W971GG6NB-6 vs W971GG6NB-25 TR 对比
详细并排对比 W971GG6NB-6 出自 Winbond 和 W971GG6NB-25 TR 出自 Winbond。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | W971GG6NB-6 | W971GG6NB-25 TR |
|---|---|---|
| 品牌 | Winbond | Winbond |
| 分类 | Memory ICs | Memory ICs |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $6.42 | $5.62 |
| 存储器类型 | DDR2 SDRAM | SDRAM - DDR2 |
| 存储容量 | 1 Gbit | 1 Gbit |
| 存储组织 | 8M x 8 banks x 16 bits | 64M x 16 (8,388,608 words x 8 banks x 16 bits) |
| Speed Grade | -6 (DDR2-667, 667 Mbps) | — |
| Interface Standard | SSTL_18 (1.8 V) | — |
| Clock Frequency | 333 MHz (667 Mbps data rate) | 400 MHz |
| Access Time | [DATA_NEEDED: precise CL-trcd-trp in ns] | 57.5 ns |
| Number of Banks | 8 | 8 |
| Burst Length | 4 / 8 (programmable) | — |
| On-Die Termination | Dynamic ODT (supported) | — |
| Data Mask (DM) | Supported | — |
| Auto Precharge | Supported | — |
| Self-Refresh | Supported | — |
| Operating Temperature Range (commercial) | 0C to +85C (TCASE) | — |
| Supply Voltage VDD/VDDQ | 1.8 V (typ) | — |
| 封装 | 84-ball TFBGA (8 x 12.5 mm) | 84-TFBGA (8 x 12.5 mm) |
| 安装类型 | Surface Mount (BGA) | Surface Mount |
| RoHS / Halogen-Free | Compliant / Halogen-Free (per Winbond) | — |
| JEDEC Standard | JEDEC DDR2 (DDR2-667 grade) | — |
| MSL 等级 | [DATA_NEEDED: MSL rating] | — |
| Write Cycle Time | — | 15 ns |
| 接口 | — | SSTL_18 |
| 电源电压 | — | 1.8 V |
| 数据速率 | — | DDR2-800 |
| Packaging | — | Tape & Reel (TR) |
| 工作温度 | — | [DATA_NEEDED: operating temperature range] |
| Refresh Interval | — | [DATA_NEEDED: refresh interval] |
| RoHS 状态 | — | Compliant (all Winbond packaging RoHS compliant per manufacturer) |